University of Virginia
The center at the University of Virginia has state of the art facility in laser processing, microfabrication and materials/device characterization.
- Femtosecond laser
- CW Diode laser (250 W)
- Pulsed Nd-YAG laser with pulse energy of >1 J
- Fiber Laser (λ = 1064 nm), pulse width 50 ns, rep. rate 30 kHz, Ave. Power 30W
- Fiber Laser (λ = 532 nm), pulse width 50 ns, rep. rate 30 kHz
- Diode lasers with wavelengths in blue, green, red and near infrared regions
- Optical power and energy meters
- Photovoltaics device fabrication and characterization facility
- High temperature furnace
- 1500 W microwave system for materials processing
- Clean room facility for micro/nanofabrication
- Materials characterization facility with SEM, TEM, XRD, AFM etc.
- Optical microscopes
- Computer controlled x-y stages
- Computer controlled galvo head
University of Michigan
The Center at the University of Michigan houses some of the latest laser processing and diagnostics capability. It houses:
- 4 KW Nd-YAG DISK Laser with 200 um fiber beam delivery from Trumpf
- 10Watts IMRA D10000 Fiber based Femtosecond laser
- 6kW Rf Excited CO2 laser
- High peak power (1012W/cm2) diode pumped SLAB Nd:YAG laser
- 8kW peak power, 400W average power Nd:YAG laser
- High Average Power Diode pumped solid‐state slab Nd:YAG lasers from the DARPA‐PLM project with 500 watts average power and 1MW peak power with focused beam diameter within three times the diffraction limit.
- 150 Watts Excimer laser
- 6kW CO2 laser can be switched between a 5‐axis CNC and a 7‐axis GMF robot for online diagnostics Ring‐dye laser with capability to deliver via single mode fiber
- 25watt Argon ion laser, 10watt Argon ion laser
- Detector for absorption, fluorescence and emission spectroscopy
Four other center/laboratories in the College of Engineering provide support and infrastructure for cross‐disciplinary laser processing research.
- The EMAL provides the latest electron‐optical techniques for sophisticated materials characterization.
- The Center for Ultrafast Optics provides access to some of the latest femtosecond lasers.
- The Solid State Electronics Laboratory houses researchers and facilities for microelectronics, MEMS, artificial intelligence, thin‐film technology, machine vision, controls, and digital image technology.
- The ERC on reconfigurable machining systems houses some of the latest equipment for machining and measurement technology.
Collectively, these laboratories create a synergism uniquely suited to multidisciplinary laser processing research. These laboratories offer an infrastructure for engineering research that has helped the U of M College of Engineering become an internationally prominent institution.
Southern Methodist University
SMU’s I/UCRC occupies about 6,000 sq, ft. in conjunction with the Research Center for Advanced Manufacturing in the Lyle School of Engineering. The following laboratories are developed to support research and research related education under the I/UCRC for Lasers and Plasmas:
- Laboratory for Laser Materials Processing
- Laboratory for Rapid Prototyping/Manufacturing
- Laboratory for Reverse Engineering
- Laboratory for Micro-welding/marking/cutting by Short Pulsed Lasers
- Laboratory for Electron Beam Materials Processing
- IPG fiber laser of 4 kW in power with two-channel optical switch
- LUMONIX Nd:YAG laser of 1 kW in power
- NUVONYX direct diode laser of 2 kW in power
- NUVONYX fiber coupled diode laser of 1 kW in power
- ARCAM electron beam melting machine of 4 kW in power, Model A2
- Electron beam welding machine equipped with a plasma window (under construction)
- MULTIFAB machine that consists of a five-axes CNC vertical machining center, a six-axes robot, a set of powder feeding system, a high-power laser and a arc welding machine
- Spectra-Physics HIPPO diode-pumped solid state short pulse laser with four wavelengths (1064, 532, 355, and 266 nm) and power of 17 W
- Lee Laser diode-pumped Nd:YAG laser with two wavelengths, 1064 nm with 200 W of power and 532 nm with power of 100 W
- Characterization: SEM, TEM, XPS, FIB, EDS, tensile test machine, micro hardness test machine; and access to a well equipped machine shop and computing facilities.
University of Illinois
- Three commercial magnetron deposition tools, including HPPMs
- Reactive Ion etching tools
- Ion beam interaction facilities
- Plasma-lithium interaction experimental facilities
- 125 kJ pulsed power facility
- 13.5 nm (EUV) lithography source
- Materials characterization including AFM, SEM, AES, TOF-SIMS, XPS, RBS, XRD/XRR, TEM/STEM, FIB, and ellipsometry at the Center for Microanalysis of Materials
- Host of clean room capabilities
